Oferta
Ref: TODE20260519017
Caduca: 19/05/2027
Descripción
A German SME specializes in advanced joining and assembly technologies for high-performance electrical and optical components. Its core expertise lies in flux-free soldering, enabling thermally stable, low-resistance and highly reliable joints for demanding applications. The solutions are particularly suitable for harsh environments such as aerospace, photonics and quantum technologies. Partners for commercial and research cooperation are sought.
Title
Flux-free and thermally stable joining solutions for high-performance photonic and electronic systems in harsh environments
Abstract
High-performance optical and electronic systems used in sectors such as aerospace, photonics, quantum technologies, and high-power electronics must meet stringent requirements regarding thermal stability, mechanical robustness, and long-term reliability. Conventional bonding and assembly approaches often suffer from thermal mismatch, high resistance interfaces, limited durability, and reduced performance under mechanical stress or temperature cycling.
A German hightech startup, founded in 2023, specializes in innovative joining and assembly technologies for high-performance electrical and optical components as well as complete systems.
The company’s core competence is the production of homogeneous, large-area solder joints for a wide variety of materials and material combinations. Unlike conventional adhesive-based or mechanically fixed assemblies, the German company applies advanced flux-free soldering technologies, enabling:
• Very low thermal and electrical resistance between components
• High thermal stability and efficient heat dissipation
• Excellent mechanical robustness and durability
• Vacuum compatibility and long-term reliability
These technologies are particularly critical for applications requiring precise thermal management and stable integration of sensitive components such as laser crystals, optics, fiber optics, semiconductors and electronic devices.
Furthermore, the SME develops and manufactures customized photonic assemblies, including laser component packaging and optical submounts. The solutions support precision alignment, packaging, and thermal management in demanding environments.
Key application areas include:
• Laser and photonics technologies
• Quantum technologies
• Electronics and high-performance computing
• Aerospace and space systems
• Electromobility and power electronics
In addition to manufacturing, the company also develops automated assembly and alignment processes, enabling scalable and reproducible production of advanced photonic and electronic systems.
• Flux-free soldering: unlike conventional soldering processes that rely on flux, this approach enables contamination-free interfaces, resulting in significantly improved long-term stability and reliability
• Extremely low thermal and electrical resistance interfaces: substantially lower losses than conventional joining methods enabling higher efficiency, improved heat dissipation, and increased power density in high-performance systems.
• High robustness under thermal cycling, vibration, and harsh environments
• Compatibility with a wide range of materials (metals, ceramics, glass, composites)
• Customizable and scalable solutions from prototype to production
• Integration of thermal management, alignment, and packaging in one process
• Potential for improved lifetime and reliability of components
A German hightech startup, founded in 2023, specializes in innovative joining and assembly technologies for high-performance electrical and optical components as well as complete systems.
The company’s core competence is the production of homogeneous, large-area solder joints for a wide variety of materials and material combinations. Unlike conventional adhesive-based or mechanically fixed assemblies, the German company applies advanced flux-free soldering technologies, enabling:
• Very low thermal and electrical resistance between components
• High thermal stability and efficient heat dissipation
• Excellent mechanical robustness and durability
• Vacuum compatibility and long-term reliability
These technologies are particularly critical for applications requiring precise thermal management and stable integration of sensitive components such as laser crystals, optics, fiber optics, semiconductors and electronic devices.
Furthermore, the SME develops and manufactures customized photonic assemblies, including laser component packaging and optical submounts. The solutions support precision alignment, packaging, and thermal management in demanding environments.
Key application areas include:
• Laser and photonics technologies
• Quantum technologies
• Electronics and high-performance computing
• Aerospace and space systems
• Electromobility and power electronics
In addition to manufacturing, the company also develops automated assembly and alignment processes, enabling scalable and reproducible production of advanced photonic and electronic systems.
• Flux-free soldering: unlike conventional soldering processes that rely on flux, this approach enables contamination-free interfaces, resulting in significantly improved long-term stability and reliability
• Extremely low thermal and electrical resistance interfaces: substantially lower losses than conventional joining methods enabling higher efficiency, improved heat dissipation, and increased power density in high-performance systems.
• High robustness under thermal cycling, vibration, and harsh environments
• Compatibility with a wide range of materials (metals, ceramics, glass, composites)
• Customizable and scalable solutions from prototype to production
• Integration of thermal management, alignment, and packaging in one process
• Potential for improved lifetime and reliability of components